IN6669 Indium/Silver Alloy Spooled Wire (In97/Ag 3)

Indium/Silver Alloy Spooled Wire (In97/Ag 3) Description

Indium/Silver Alloy Spooled Wire (In97/Ag3) is a eutectic alloy composed of 97% indium and 3% silver by weight. Its eutectic nature ensures a single melting point at 143°C, eliminating the plastic range between solidus and liquidus temperatures. This allows rapid solidification and precise bonding in applications requiring minimal thermal stress. This alloy exhibits excellent ductility and high thermal conductivity, making it suitable for low-temperature soldering processes, particularly in cryogenic environments and precision electronics assembly.

The material demonstrates outstanding oxidation resistance due to indium's inherent stability, ensuring reliable bonding even in sensitive applications like aerospace and photovoltaics. Its low electrical resistivity enhances performance in electrical interconnects, while adding silver improves mechanical strength without compromising flexibility. The alloy is supplied in spooled form, facilitating both automated and manual soldering workflows.

Environmentally, it is classified under WGK 3 (moderately hazardous to water) and stored as non-combustible solids (Storage Class Code 13). Its compliance with RoHS standards further supports its use in eco-sensitive industries. The combination of low melting temperature, thermal stability, and corrosion resistance positions In97/Ag3 as a critical material in semiconductor packaging, optoelectronics, and advanced metallurgical applications.

Indium/Silver Alloy Spooled Wire (In97/Ag 3) Applications

1. Low-Temperature Soldering: Ideal for heat-sensitive components in electronics (e.g., LEDs, MEMS devices) and cryogenic systems (superconducting circuits), as its 143°C melting point minimizes thermal damage.

2. Semiconductor Packaging: Used for die attachment in power electronics and optoelectronic modules, ensuring reliable thermal and electrical conductivity in high-performance chips.

3. Aerospace & Defense: Bonds components in satellites and avionics, where extreme thermal cycling and vacuum environments demand oxidation-resistant, fatigue-resistant joints.

4. Photovoltaics: Connects solar cell interconnects with minimal stress, enhancing durability under temperature fluctuations.

5. Medical Devices: Employed in hermetic sealing of implantable sensors or MRI equipment, leveraging biocompatibility and low-temperature processing.

6. Thermal Interface Materials (TIMs): Creates efficient heat-transfer layers in CPUs, GPUs, and power modules, exploiting its high thermal conductivity.

7. Flexible Electronics: Bonds thin-film circuits in wearable tech, benefiting from the alloy’s ductility and low creep resistance.

Indium/Silver Alloy Spooled Wire (In97/Ag 3) Packaging

Our products are packaged in customized cartons of various sizes based on the material dimensions. Small items are securely packed in PP boxes, while larger items are placed in custom wooden crates. We ensure strict adherence to packaging customization and the use of appropriate cushioning materials to provide optimal protection during transportation.

Packaging: Carton, Wooden Box, or Customized.

Kindly review the packaging details provided for your reference.

Manufacturing Process

1.       Testing Method

(1)    Chemical Composition Analysis - Verified using techniques such as GDMS or XRF to ensure compliance with purity requirements.

(2)    Mechanical Properties Testing - Includes tensile strength, yield strength, and elongation tests to assess material performance.

(3)    Dimensional Inspection - Measures thickness, width, and length to ensure adherence to specified tolerances.

(4)    Surface Quality Inspection - Checks for defects such as scratches, cracks, or inclusions through visual and ultrasonic examination.

(5)    Hardness Testing - Determines material hardness to confirm uniformity and mechanical reliability.

Please refer to the SAM testing procedures for detailed information.

Indium/Silver Alloy Spooled Wire (In97/Ag 3) FAQs

Q1. What are the key properties of In97/Ag3 alloy?

The alloy features a low eutectic melting point (143°C), high thermal/electrical conductivity, excellent ductility, oxidation resistance, and fatigue resistance. Its single-phase solidification ensures precise bonding with minimal thermal stress.

Q2. Why is it suitable for low-temperature soldering?

Its 143°C melting point prevents damage to heat-sensitive components (e.g., LEDs, semiconductors), making it ideal for cryogenic systems, medical devices, and flexible electronics.

Q3. How does it perform in extreme environments?

The alloy resists oxidation and thermal fatigue, excelling in aerospace (satellites, avionics), photovoltaics (solar cells), and high-vacuum applications.

Performance Comparison Table with Competitive Products

Related Information

1.       Common Preparation Methods

The fabrication of advanced materials and alloys involves a range of specialized techniques tailored to optimize performance for specific applications. Key processes include powder metallurgy sintering, where metal or alloy powders, produced via atomization, reduction, or electrolysis, are compacted under high pressure and sintered below their melting points. Methods like spark plasma sintering (SPS) enable rapid heating (e.g., 1963K for TiN ceramics) to achieve nanostructured materials with minimal grain growth, while liquid-phase sintering leverages transient molten phases to enhance densification. Atmosphere control during sintering (using hydrogen, argon, or vacuum) prevents oxidation and ensures material integrity.

For soldering applications, eutectic alloys such as In97/Ag3 (melting at 143°C) are critical for low-temperature bonding in electronics and cryogenic systems, offering minimal thermal stress. Non-eutectic alloys like In90/Ag10 provide a plastic temperature range (143–237°C), accommodating flexible circuit assembly. High-temperature solders, such as SAC305 (Sn/Ag/Cu), are processed via vacuum melting and controlled cooling for automotive or aerospace use.

Surface treatments like indium electroplating employ sulfamate baths (pH 1.8–2.0, 20–30°C) with amine additives to deposit smooth, corrosion-resistant coatings, achieving over 80% cathode efficiency. Chemical nickel plating relies on precise thermal management to stabilize the bath and avoid decomposition.

Welding techniques are equally specialized. TIG welding uses non-consumable tungsten electrodes under argon shielding for thin, oxidation-sensitive components, while MIG welding employs consumable wire electrodes (e.g., Al-Si alloys) with Ar/CO₂ gas for thicker plates, enabling high-speed spray transfer modes.

Advanced processing methods include gradient material fabrication via SPS with temperature-controlled molds (e.g., stainless steel/ZrO₂ composites) and non-consumable electrode melting for high-purity semiconductors like InAs/AlSb heterostructures. Heat treatments such as quenching, tempering, or nitriding (e.g., 38CrMoAlA steel) enhance mechanical properties like hardness (45–52 HRC) and wear resistance

Additive manufacturing techniques, including binder jetting and selective laser sintering, enable 3D-printed metal composites, often followed by hot isostatic pressing (HIP) for densification. Meanwhile, sputtering targets for solar cells are produced through inert-atmosphere melting and rapid solidification to ensure compositional homogeneity.

These processes collectively address demands across aerospace, electronics, renewable energy, and biomedical sectors, emphasizing precision, efficiency, and adaptability to emerging material challenges.