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Stanford Advanced Materials is committed to delivering advanced materials that set industry standards in performance and reliability. Our innovative approach and precise engineering help meet the rigorous demands of contemporary high-tech applications.

Aluminum Titanium Silicon Planar Target, AlTiSi Target is engineered for sputtering deposition processes. It incorporates a balanced blend of aluminum, titanium, and silicon to achieve a consistent planar structure conducive to uniform thin film formation. Stanford Advanced Materials (SAM) applies controlled vacuum melting and accurate machining during production. Quality control measures include spectroscopic verification of elemental composition and surface condition to minimize irregularities in technical applications.

Stanford Advanced Materials is renowned for its commitment to innovation and quality in advanced thin film deposition technologies. Our expertise ensures reliable, high-performance sputtering targets that meet the rigorous demands of modern industrial applications.

Copper Zinc Planar Target, CuZn Target is produced using a precision planar fabrication process. Stanford Advanced Materials (SAM) applies controlled alloying techniques and performs microscopic surface inspections to minimize microstructural inconsistencies. The product undergoes a systematic quality control procedure that includes dimensional verification and surface roughness measurement. This approach ensures consistent material performance suitable for sputtering applications and precise thin film deposition processes.

Stanford Advanced Materials is renowned for its pioneering approach in producing high-performance advanced materials tailored for critical industrial applications. With a strong commitment to innovation and stringent quality control, SAM consistently delivers reliable and cutting-edge solutions to meet the evolving demands of the modern manufacturing landscape.

Stanford Advanced Materials is renowned for delivering innovative materials engineered to meet the stringent demands of advanced industrial applications. Our commitment to quality and precision drives the development of products that consistently perform in cutting-edge processes.

Titanium Silicon Target, TiSi Target is produced for sputtering processes in thin film applications. Manufactured by Stanford Advanced Materials (SAM), it features a uniform TiSi composition verified using SEM imaging and laser profilometry. SAM uses rigorous batch testing and microanalysis to minimize contaminants and ensure consistent material properties. The controlled processing environment supports the reproducibility essential in advanced deposition techniques.

Stanford Advanced Materials is dedicated to delivering precision-engineered sputtering targets that consistently meet the rigorous demands of cutting-edge industries. Our commitment to innovation and quality has positioned us as a trusted leader in advanced material solutions.

Nickel Molybdenum Planar Target, NiMo Target is manufactured from a refined nickel-molybdenum alloy with a flat geometry, essential for controlled sputtering deposition. Stanford Advanced Materials (SAM) implements targeted material characterization including X-ray diffraction and electron microscopy to verify compositional integrity and surface uniformity. The target supports precise thin film applications by delivering consistent erosion behavior during sputtering.

Nickel Chromium Aluminum Target, NiCrAl Target is engineered with a controlled NiCrAl alloy composition for sputtering applications. Stanford Advanced Materials (SAM) utilizes systematic process controls including in-line optical inspections and material composition analysis to maintain strict tolerances. Their manufacturing process includes detailed microstructural evaluation to verify alloy homogeneity, ensuring the target meets industry process standards for film deposition. Such tangible quality control measures support adherence to critical performance metrics during target fabrication.