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Stanford Advanced Materials

Indium Alloys

Indium Alloys exhibit lower crack propagation and high resistance to thermal fatigue. The ductility of Indium will allow some materials with different coefficients of thermal expansion to be joined together. Despite the metal’s softness, it can strengthen the materials it is alloyed with.

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Indium Alloys
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IN6633 Indium/Silver Alloy Plate (In97/Ag 3)
IN6633 Indium/Silver Alloy Plate (In97/Ag 3)

Stanford Advanced Materials, a company specializing in the research and production of advanced materials, guarantees that each of its products reaches international leading standards through meticulous craftsmanship and strict quality control. The Indium/Silver Alloy Plate (In97/Ag3) is a highly ductile, low-melting-point alloy composed of 97% indium and 3% silver, offering exceptional thermal conductivity, oxidation resistance, and seamless formability for precision applications in semiconductor packaging, cryogenic sealing, and flexible electronics interconnects.

Related Products: Indium/Silver Alloy Foil (In97/Ag 3), Silver Foil/Sheet/Disc

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Indium/Silver Alloy Spooled Wire (In97/Ag 3)
IN6669 Indium/Silver Alloy Spooled Wire (In97/Ag 3)

Stanford Advanced Materials, a company specializing in the research and production of advanced materials, guarantees that each of its products reaches international leading standards through meticulous craftsmanship and strict quality control. Indium/Silver Alloy Spooled Wire (In97/Ag3) is a low-temperature lead-free solder wire produced by Chip Quik, composed of a 97% indium and 3% silver alloy with a melting point of 143°C. Designed for microelectronics assembly, glass/ceramic encapsulation, and sensitive component applications, it offers low melting point, excellent wettability, and fatigue resistance, while complying with RoHS standards. Packaged in spooled form with integrated no-clean flux for convenience.

Related Products: Indium/Silver Alloy Foil (In97/Ag 3), Silver Foil/Sheet/Disc

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Indium Tin Alloy Rod
IN5829 Indium Tin (In-Sn) Alloy Rod

Indium Tin Alloy Rod is a solid metallic rod composed of a combination of indium and tin. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Indium Tin Alloy Rod.

Related products: Copper Indium Alloy Powder (Cu-In), Indium Tin Alloy Foil, Indium Tin Alloy Wire

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Indium Tin Alloy Foil
IN5830 Indium Tin Alloy Foil (In-Sn Alloy Foil)

Indium Tin Alloy Foil is a solid metallic foil composed of a combination of indium and tin. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Indium Tin Alloy Foil.

Related Products: Copper Indium Alloy Powder (Cu-In), Indium Tin Alloy Rod, Indium Tin Alloy Wire

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Indium Tin Alloy Wire
IN5831 Indium Tin (In-Sn) Alloy Wire

Indium Tin Alloy Wire is a solid metallic wire composed of a combination of indium and tin. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Indium Tin Alloy Wire.

Related Products: Copper Indium Alloy Powder (Cu-In), Indium Tin Alloy Rod, Indium Tin Alloy Foil

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Indium Tin Rotary Target, InSn Target
ST11193 Indium Tin Rotary Target, InSn Target

Indium Tin Rotary Target, InSn Target is a sputtering target composed of Indium-Tin alloy, engineered for deposition processes in semiconductor and flat panel display manufacturing. Stanford Advanced Materials (SAM) employs advanced alloy blending and surface analysis using X-ray fluorescence and profilometry to reduce material variance. Rigorous quality control through batch testing and statistical process control ensures that target composition and surface uniformity meet precise process specifications.

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IN7054
IN7054 Indium/Silver Alloy Foil (In97/Ag 3)

Indium/Silver Alloy Foil (In97/Ag 3) is recognized for its superior thermal and electrical conductivity, outstanding ductility, and reliability in various high-performance applications. Stanford Advanced Materials provides Indium-based alloys at competitive pricing, supported by unmatched customer service and technical expertise.

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CU4260 Copper Indium Alloy Powder (Cu-In)
CU4260 Copper Indium Alloy Powder (Cu-In)

Copper Indium Alloy Powder (Cu-In) is one of the basic targets of CIG (Copper Indium Gallium) and CIGS (Copper Indium Gallium Selenide) thin-film solar materials. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Copper Indium Alloy Powder (Cu-In).

Related products: Tungsten Nickel Copper Alloy, Nano Copper Nickel Alloy Powder, Aluminum Copper Master Alloy, Molybdenum Copper Alloy

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