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PBN0922 Pyrolytic Boron Nitride Crucible, PBN Crucibles

Catalog No. PBN0922
Dimensions 5ml~5L
Material PBN, Pyrolytic Boron Nitride
Standard LEC, MBE, VGF
Purity 99.99%
Form Crucible
Melting Point 220-230℃

Pyrolytic Boron Nitride Crucibles (PBN Crucibles) are extremely pure and can work under high vacuum circumstances. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality PBN Crucibles.

Related products: PBN/PG Composite Heating Elements, Pyrolytic Boron Nitride (PBN) Tubes, Pyrolytic Boron Nitride (PBN) Plates/Discs, PBN Machined Products

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PBN Crucibles, Pyrolytic Boron Nitride Description

Pyrolytic Boron Nitride Crucibles (PBN Crucibles) from SAM have a much better purity level compared with normal boron nitride ceramic materials. Using BCl3 and NH3 as raw materials, pure pyrolytic boron nitride crucibles can be prepared by chemical vapor deposition (CVD) process at high temperature and low pressure, because the purity of steam is easier to control. Most PBN products made by the CVD process have less than 100 ppm of total impurities, which means purity is better than 99.99%. High-purity PBN products have excellent mechanical properties such as high electrical resistance and good thermal conductivity.

PBN Crucibles, Pyrolytic Boron Nitride Specifications

Material

PBN

Purity

≥99.99%

Density

1.95-2.22 g/cm3

Tensile Strength

153.86 N/mm2, 112 MPa

Bending Strength

243.63 N/mm2, 173 MPa

Compression Strength

154 MPa

Max. Working Temperature

2400℃

Specific Heat Capacity

0.89 J/g·℃

Electrical Resistivity

2*1015 Ω·cm

Dielectric Strength (RT)

>2*105 D.C. Volts/mm

Thermal Conductivity (W/M·K)

43-60

*The above product information is based on theoretical data. For specific requirements and detailed inquiries, please contact us.

Available Pyrolytic Boron Nitride Crucible Products

Crucible Types

Image

Type

LEC

MBE

VGF

Applications

Czochralski Method

Molecular Beam Epitaxy

Vertical Gradient Freeze

*Customization is available based on drawings.

The PBN crucible product code is composed as follows:

Abbreviations and code:

C conical-shaped crucibles
D double-wall crucibles
Ø lip

Capacity 1cm³ ~ 10 cm³ 
PBN-1-12 PBN-1-14   
Code: PBN 1-12 Code: PBN 1-14 Code: PBN 1-20 Code: PBN 2-16 Code: PBN C2-22
Capacity:1 cm³  Capacity:1 cm³  Capacity: 1.5 cm³ Capacity: 2 cm³  Capacity: 2 cm³
Code: PBN 5-16 Code: PBN C5-27 Code: PBN C5-29 Code: PBN C8-27 Code: PBN 10-22
Capacity: 5 cm³ Capacity: 5 cm³ Capacity:5 cm³  Capacity: 8 cm³ Capacity: 10 cm³
Capacity 10cm³ ~ 100 cm³ 
 
Code: PBN C12-36 Code: PBN C12-37 Code: PBN C16-36 Code: PBN C25-33 Code: PBN C25-51
Capacity: 12 cm³ Capacity: 12 cm³ Capacity: 16 cm³ Capacity: 25 cm³ Capacity: 25 cm³
Code: PBN 35-34 Code: PBN C40-51 Code: PBN C60-54 Code: PBN60-37 Code: PBN C70-60
Capacity: 35 cm³ Capacity: 40 cm³ Capacity: 60 cm³ Capacity: 60 cm³ Capacity: 70 cm³
    
Code: PBN C75-77 Code: PBN C80-54 Code: PBN C82-71  Code: PBN 85-41  
Capacity: 75 cm³ Capacity: 80 cm³ Capacity: 82 cm³  Capacity: 85 cm³  
Capacity 100 cm³ ~ 500 cm³ 
Code: PBN 125-54 Code: PBN 130-54  Code: PBN 150-60   Code: PBN 155-60 Code: PBN 160-60
Capacity: 125 cm³ Capacity: 130 cm³  Capacity: 150 cm³  Capacity: 155 cm³ Capacity: 160 cm³
 
Code: PBN C200-84 Code: PBN 200-58 Code: PBN 200-102 Code: PBN 420-84  
Capacity: 200 cm³ Capacity: 200 cm³ Capacity: 200 cm³ Capacity: 420 cm³  

PBN Crucibles, Pyrolytic Boron Nitride Applications

Crucibles for GaAs, InP, CdTe, and other III-V compound crystal growth

MOCVD and CVD systems for semiconductor and optoelectronic production

Evaporation sources for thin film deposition in vacuum coating systems

High-purity chemical or metal melting and containment

Laboratory containers for high-temperature material testing

PBN Crucibles, Pyrolytic Boron Nitride Packaging

Our PBN Crucibles are carefully handled during storage and transportation to preserve the quality of our product in its original condition.

Comparison Table

PBN (Pyrolytic Boron Nitride) Crucible vs Hot Pressed BN (HPBN) Crucible

Feature

PBN Crucible

Hot Pressed BN Crucible

Manufacturing Method

Chemical Vapor Deposition (CVD)

High-temperature vacuum hot pressing

Purity

Ultra-high (≥99.99%)

High (typically ≥98%)

Density

High and uniform

Moderate to high, depending on grade

Mechanical Strength

Lower, fragile in large sizes

Higher, suitable for machining and larger sizes

Surface Finish

Smooth, non-porous

Slightly rougher, may have open porosity

Thermal Shock Resistance

Excellent

Very good

Temperature Resistance

Up to ~1800°C in vacuum/inert

Up to ~2100°C in vacuum/inert

Electrical Insulation

Excellent

Excellent

Machinability

Difficult

(as-deposited shape only)

Excellent

(can be machined into complex shapes)

Typical Applications

Semiconductor crucibles, MBE, evaporation

Metallurgy, crystal growth, laboratory crucibles

Cost

Higher (due to complex CVD process)

Lower to moderate

Product Comparison

Crucible Type

Material

Max Temp (°C)

Thermal Conductivity

Thermal Shock Resistance

Chemical Resistance

Applications

Quartz Ceramic

Quartz Ceramic

1100

Low

High

High

General laboratory

BeO Ceramic

Beryllium Oxide

1800

Very High

High

High

High-temperature, electronics

PG Coated C

PG coated Graphite

2000

High (anisotropic)

Very High

High

Crystal growth, evaporation

PG Coated PBN

PG coated PBN

1800

High

Very High

Very High

High-purity crystal growth

PBN Crucible

Pyrolytic BN

1800

High

Very High

Very High

MBE, OLED, VGF, LEC processes

AlN Crucible

Aluminum Nitride

1800

High

High

High

Semiconductor, packaging

SiC Crucible

Silicon Carbide

1600

High

Very High

High

Metal melting, foundry

H-BN Crucible

Hot Pressed BN

1800

Moderate

Very High

High

Metal processing, soldering

Al Titanate

Aluminum Titanate

1400

Low

Excellent

Moderate

Thermal cycling, glass industry

Alumina Crucible

Aluminum Oxide

1700

Moderate

Moderate

High

General high-temperature

Quartz for Si

Fused Quartz

1200

Low

High

High

Silicon single crystal growth (Czochralski)

FAQs

Q1: What is Pyrolytic Boron Nitride (PBN)?

Pyrolytic Boron Nitride (PBN) is a high-performance, high-purity form of boron nitride that is produced through a chemical vapor deposition (CVD) process. It is known for its excellent thermal conductivity, electrical insulation properties, and resistance to high temperatures.

Q2: What are the key properties of Pyrolytic Boron Nitride?

High Thermal Conductivity: Provides excellent heat dissipation, making it suitable for high-temperature applications.

Electrical Insulation: It is an excellent electrical insulator, making it ideal for electronic and semiconductor applications.

High-Temperature Resistance: Can withstand temperatures of up to 2000°C in inert atmospheres.

Chemical Stability: Resistant to most chemicals, including acidic and alkaline environments.

Low Coefficient of Thermal Expansion (CTE): Offers low expansion, ensuring stability under varying temperatures.

Q3: What are the main applications of Pyrolytic Boron Nitride?

Semiconductor Industry: Used as a material for substrates, insulators, and high-performance components in semiconductor manufacturing.

Aerospace and Defense: Used for thermal management, high-temperature insulation, and radiation shielding.

Electronics and Electrical Engineering: Ideal for components that require electrical insulation and high heat resistance.

Molds and Dies: Used in the production of molds for high-precision manufacturing and in applications requiring heat resistance.

Related articles:

Pyrolytic Boron Nitride: layered structure and simple quality assurance

Boron Nitride ceramic: A bullet proof material

How Stanford Advanced Materials Provided Customized Boron Nitride Refractory Devices

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